Typical Characteristics T J = 25°C unless otherwise noted
4.5
2000
4.0
I D = -4.0 A
1000
C iss
3.5
3.0
2.5
V DD = -5 V
V DD = -10 V
C oss
2.0
1.5
V DD = -15 V
100
C rss
1.0
0.5
f = 1 MHz
V GS = 0 V
0.0
0
3
6
9
12
10
0.1
1
10
20
Q g , GATE CHARGE (nC)
Figure7. Gate Charge Characteristics
50
10
100 μ s
1000
-V DS , DRAIN TO SOURCE VOLTAGE (V)
Figure 8. Capacitance vs Drain
to Source Voltage
V GS = -4.5 V
1 ms
100
1
10 ms
THIS AREA IS
LIMITED BY r DS(on)
100 ms
10
0.1
SINGLE PULSE
T J = MAX RATED
R θ JA = 156 o C/W
1s
10 s
DC
SINGLE PULSE
R θ JA = 156 o C/W
T A = 25 o C
10
10
10
10
0.01
0.1
T A = 25 o C
1
10
60
1
0.5
-4 -3
-2
-1
1
10
100
1000
2
-V DS , DRAIN to SOURCE VOLTAGE (V)
Figure 9. Forward Bias Safe
Operating Area
t, PULSE WIDTH (sec)
Figure 10. Single Pulse Maximum
Power Dissipation
1
DUTY CYCLE-DESCENDING ORDER
D = 0.5
0.2
0.1
0.1
0.05
0.02
0.01
P DM
0.01
NOTES:
t 1
t 2
R θ JA = 156 C/W
SINGLE PULSE
o
DUTY FACTOR: D = t 1 /t 2
PEAK T J = P DM x Z θ JA x R θ JA + T A
10
10
10
10
0.001
-4
-3
-2
-1
1
10
100
1000
t, RECTANGULAR PULSE DURATION (sec)
Figure 11. Junction-to-Ambient Transient Thermal Response Curve
?2010 Fairchild Semiconductor Corporation
FDC642P Rev . C2
4
www.fairchildsemi.com
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